NEO Semiconductor 3D X-DRAM With 8x the Density Of DDR5 Computer Memory

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 layers. This is 8 times greater compared to today’s best solutions with DDR5 technology. Neo Semiconductor is located in San Jose, California. 3D stacking of silicon …

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Penn Engineers Pave Way for Chip Components that Could Serve as Both RAM and ROM

New materials may also enable entirely new paradigms for individual chip components and their overall design. One long-promised advance is the ferroelectric field-effect transistor, or FE-FET. Such devices could switch states rapidly enough to perform computation, but also be able to hold those states without being powered, enabling them to function as long-term memory storage. …

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Nano Dimension AME Academy Event for 3D Additive Electronics

TheAME Academy is the first ever seminar on Additive Manufacturing of Electronics with leading industry experts. This online event will cover the future of additive manufacturing, software, hardware and automation for electronic devices. Attendees will hear first-hand about revolutionary applications and advancements of this technology from R&D to commercial applications by leading research institutes and …

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LG Has 20X65 Foot Curved TV Waterfall Display at CES

LG Electronics has an immersive exhibit of flexible commercial displays at CES® 2019. The “LG OLED Falls” display features 260 LG OLED digital signage screens, in curved and flat configurations. It measures 20 feet high and 65 feet wide, displaying alluring images of curves of the desert, waterfalls, ocean and light. The incredible video experience …

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Graphene superlattices could be used for superconducting transistors

Researchers created a “superlattice” of two graphene sheets stacked together — not precisely on top of each other, but rotated ever so slightly, at a “magic angle” of 1.1 degrees. The hexagonal honeycomb pattern is offset slightly, creating a precise moiré configuration that is predicted to induce strange, “strongly correlated interactions” between the electrons in …

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Boring electrical power distribution could give China’s Navy railguns and other huge advantages

The US is moving ahead with deployment of combat lasers up to 300 kilowatts in power over the next 3-5 years versus 32 megajoule railguns. Only one megawatt of power is needed for combat lasers versus tens of megawatts for railguns. * China has deployed a demo railgun * the US thought about a demo …

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Battery-free wireless RFID sensor from graphene oxide for Internet of Things Applications

Researchers have a design that layers graphene oxide, to create flexible heterostructure humidity sensors for remote sensing. * layer by layer printing allows for scalable and mass production at a very low cost. * the first printable technology where several 2D materials combine to create a functional device immediately suitable for industrial applications. * No …

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Gallium Nitride transferred to Flexible Substrate for better antennas, communication and wearable electronics

The US Air Force Research Laboratory (AFRL) has demonstrated a new method to transfer gallium nitride (GaN) on a flexible substrate, a development that could lead to improved communications and radar systems, as well as wearable electronics. Next generation military and civilian applications require the ability to transfer more data, faster, at a high level …

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Key component for quantum computers miniaturized by 1000 times

The Microwave circulator is a key part of many quantum computer implementations and researchers has been miniaturized by 1000 times. Making parts like these smaller will help enable quantum computers with millions of qubits. Above – Lead author of the study, PhD candidate Alice Mahoney, in the quantum science laboratories at the Sydney Nanoscience Hub. …

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DARPA leading electronics revolution to go beyond printed circuit boards with modular chiplets

DARPA has kicked off the Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program. “The CHIPS program is part of DARPA’s much larger effort, the Electronics Resurgence Initiative, in which we are striving to build an electronics community that mixes the best of the commercial and defense capabilities for national defense,” Chappell said. “If …

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