In a patent published last week, Intel reveals how nanotubes’ strength and heat-dissipating properties can be used to reinforce the conducting copper tracks that connect millions of transistors together.
Inventor Chi-Won Hwang says depositing heat-sink nanotubes on electrically insulating layers adjacent to the copper tracks slashes the thermal stress caused by fast-pulsing electric currents
Brian Wang is a Futurist Thought Leader and a popular Science blogger with 1 million readers per month. His blog Nextbigfuture.com is ranked #1 Science News Blog. It covers many disruptive technology and trends including Space, Robotics, Artificial Intelligence, Medicine, Anti-aging Biotechnology, and Nanotechnology.
Known for identifying cutting edge technologies, he is currently a Co-Founder of a startup and fundraiser for high potential early-stage companies. He is the Head of Research for Allocations for deep technology investments and an Angel Investor at Space Angels.
A frequent speaker at corporations, he has been a TEDx speaker, a Singularity University speaker and guest at numerous interviews for radio and podcasts. He is open to public speaking and advising engagements.