ASML expects to ship 20 to 24 extreme ultraviolet (EUV) lithography tools next year as the industry continues edging closer to production deployment of the oft-delayed next-generation lithography technology.
Peter Wennink, ASML’s president and CEO, told analysts following the company’s first quarter financial report Wednesday that the company continues to make progress toward its goals for EUV of 125 wafers per hour productivity and 90 percent light-source availability. Wennik alluded to presentations at the recent SPIE Advanced Lithography Conference from Intel, Samsung and TSMC showing their latest results with EUV systems and the status of the EUV infrastructure.
EUV is now poised to be deployed in production in the next couple years beginning with the 7nm node by the likes of Intel, TSMC and Samsung.
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