Intel Will Ship Chip With 7 Nanometer Technology in 2021 and Triple AI Speed 10 nm Chip in 2019

Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, announced that Intel will start shipping its volume 10-nanometer client processor in June and shared first details on the company’s 7-nanometer process technology.

Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, spoke at the 2019 Intel Investor Meeting in Santa Clara, California, on Wednesday, May 8, 2019. Slides from his presentation included information on process technology and packaging, 10nm “Ice Lake” processors, and Intel’s innovation. (Credit: Intel Corporation)
Dr. Murthy Renduchintala, Intel’s chief engineering officer and group president of the Technology, Systems Architecture and Client Group, spoke at the 2019 Intel Investor Meeting in Santa Clara, California, on Wednesday, May 8, 2019. Slides from his presentation included information on process technology and packaging, 10nm “Ice Lake” processors, and Intel’s innovation. (Credit: Intel Corporation)

10nm Process Technology: Intel’s first volume 10nm processor, a mobile PC platform code-named “Ice Lake,” will begin shipping in June. The Ice Lake platform will take full advantage of 10nm along with architecture innovations. It is expected to deliver approximately 3 times faster wireless speeds, 2 times faster video transcode speeds, 2 times faster graphics performance, and 2.5 to 3 times faster artificial intelligence (AI) performance over previous generation products.

Ice Lake-based devices from Intel OEM partners will selling by Christmas this year. Intel also plans to launch multiple 10nm products across the portfolio through 2019 and 2020, including additional CPUs for client and server, the Intel® Agilex™ family of FPGAs, the Intel® Nervana™ NNP-I (AI inference processor), a general-purpose GPU and the “Snow Ridge” 5G-ready network system-on-chip (SOC).

7nm Status: Renduchintala provided first updates on Intel’s 7nm process technology that will deliver 2 times scaling and is expected to provide approximately 20 percent increase in performance per watt with a 4 times reduction in design rule complexity. It will mark the company’s first commercial use of extreme ultraviolet (EUV) lithography, a technology that will help drive scaling for multiple node generations.

The lead 7nm product is expected to be an Intel Xe architecture-based, general-purpose GPU for data center AI and high-performance computing. It will embody a heterogeneous approach to product construction using advanced packaging technology. On the heels of Intel’s first discrete GPU coming in 2020, the 7nm general-purpose GPU is expected to launch in 2021.

SOURCES – Intel

7 thoughts on “Intel Will Ship Chip With 7 Nanometer Technology in 2021 and Triple AI Speed 10 nm Chip in 2019”

  1. not really, the two companies internal measurements are not to the same standard, AMD’s 7nm tech is more akin to Intels 10nm.

  2. Agreed with the Core, DDR and IPU modules.

    Seeing the huge size of the GT module, it has to be the 3D graphics module (Intel seems to brand it as Graphics Technology).

    That makes the Display module, the interface with screens and cameras, and a bunch of DSP for image processing.

    Type C must be the USB controller (the last standard is USB 3 Type C) and probably other I/O protocols (Network, PCI, …).

    OPIO, being close to the Type C I/O module, has to be some other kind of I/O protocol. Google returns old references to On Package I/O, connecting the SOC (the CPU + GPU chip) to an SDRAM separate chip.

    RING, being between the cores, must be a ring bus to intercommunicate them.

    By the way, I miss the L2 and L3 shared caches. Where are they ?, in the non-labeled top-left corner ?.

  3. Intel is having trouble meeting its current target. AMD is already delivering 7nm CPUs.

  4. In an above graphic, a chip is divided into functional blocks. I don’t know what they all are so please help. They are:

    DDR double data rate memory
    Core CISC processing core
    Display graphics
    IPU interference processing unit?
    Type C ?
    GT ?
    OPIO ?
    RING ?

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