TSMC Roadmap to One Million Times Better Energy Efficient Compute Performance by 2040

Here is a presentation by Taiwan Semiconductor Chairman Liu. TSMC and Samsung are the current masters of EUV lithography. TSMC has the lead.

Extreme ultraviolet (EUV) lithography has enabled TSMC to achieve higher patterning fidelity, shorter cycle times and reduced process complexity and defect rates. TSMC uses EUV in ten mask layers for the 5nm node. They are used at the line cut, contact and metal line patterning, with single-layer EUV patterning replacing multiple layers of earlier technologies that use deep ultraviolet (DUV) lithography. TSMC will have twelve layer masks for the 3 nm node.

TSMC is still tracking to deliver 2x energy-efficient performance every two years. They have a roadmap for 1 million times better energy efficiency by 2040.

TSMC is also researching nanosheets and carbon nanotubes to go beyond current chips.

SOURCES- TSMC, ISSCC 2021 (International Semiconductor Circuit Conference)
Written by Brian Wang, Nextbigfuture.com

3 thoughts on “TSMC Roadmap to One Million Times Better Energy Efficient Compute Performance by 2040”

  1. "2x energy-efficient performance every two years. They have a roadmap for 1 million times better energy efficiency by 2040."
    No. Your math is off.

    Between now and 2040 there are 10 iterations of 2 year periods. 2^10 = 1024, or "1K".
    If it was every year, it would be 1M, or approximately 1 million times better.

    Still, 1000 times better energy-efficient performance ain't bad. It's a very huge accomplishment.

  2. The extrapolation of performance over several orders of magnitude is the sort of thing we've grown to expect from startup Fusion hopefuls. The difference being that the chip makers are churning out working products.

  3. Odd. There is no mention here that Samsung and TSMC rely on manufacturing equipment from the Dutch firm ASML for their most advanced EUV chip making processes. The US government is pressuring ASML not to export their machines to China.

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