Here is a presentation by Taiwan Semiconductor Chairman Liu. TSMC and Samsung are the current masters of EUV lithography. TSMC has the lead.
Extreme ultraviolet (EUV) lithography has enabled TSMC to achieve higher patterning fidelity, shorter cycle times and reduced process complexity and defect rates. TSMC uses EUV in ten mask layers for the 5nm node. They are used at the line cut, contact and metal line patterning, with single-layer EUV patterning replacing multiple layers of earlier technologies that use deep ultraviolet (DUV) lithography. TSMC will have twelve layer masks for the 3 nm node.
TSMC is still tracking to deliver 2x energy-efficient performance every two years. They have a roadmap for 1 million times better energy efficiency by 2040.
TSMC is also researching nanosheets and carbon nanotubes to go beyond current chips.
SOURCES- TSMC, ISSCC 2021 (International Semiconductor Circuit Conference)
Written by Brian Wang, Nextbigfuture.com
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