TrendForce projects that Nvidia GB200 Rack mass production and peak shipments are unlikely to occur until between Q2 and Q3 of 2025. This is largely due to the higher design specifications of the GB200 rack, including its requirements for high-speed interconnect interfaces and thermal design power (TDP), which significantly exceed market norms.
The NVIDIA GB rack series, which includes the GB200 and GB300 models, features more complex technology and higher production costs, making it a preferred solution for large CSPs. Other potential users include Tier-2 data centers, national sovereign cloud providers, and academic research institutions engaged in HPC and AI applications. The GB200 NVL72 is expected to become the most widely adopted model in 2025, potentially accounting for up to 80% of total deployments as NVIDIA ramps up its market push.
NVIDIA aims to boost the computational performance of AI and HPC server systems with its proprietary NVLink technology, enabling high-speed interconnections between GPU chips.
Production volume is anticipated to ramp up gradually from 1Q25 onward. However, as components of the AI server system are still undergoing supply chain adjustments, 2024 year-end shipments are expected to fall short of industry expectations. Consequently, TrendForce forecasts that the peak shipment period for the GB200 full-rack system will be postponed to between Q2 and Q3 of 2025.
Liquid cooling has become essential with the GB200 NVL72’s 140 kW TDP surpassing the limits of traditional air-cooled solutions.

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