Tesla plans to split Dojo 3 chip production, with Samsung handling front-end manufacturing and Intel taking on specialized packaging. This is a move away from TSMC’s full-process control. Samsung’s foundry to produce D3 chips will use the 2nm process for Tesla’s AI6 and Dojo 3.
Intel will use leverage EMIB 2.5D packaging for Dojo’s large-scale chip modules.
This is an unprecedented new collaboration between Samsung and Intel, fierce rivals in foundry and packaging.
Tesla aims to integrate AI6 and Dojo 3 chips into a unified architecture for FSD, robots, and data centers.
Report: [Exclusive] Tesla Taps Samsung, Intel for Dojo Supercomputer Supply Chain
Tesla is reportedly making a major change to its 'Dojo' supercomputing system supply chain, tapping both Samsung Electronics and Intel. Tesla is understood to be moving away from a structure where… pic.twitter.com/VRx0eklCx3
— Jukan (@Jukanlosreve) August 7, 2025
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