Lithography Leader ASML Hyper-NA is Next Step in Smaller Transistors. 2.9X Density.

High NA EUV is the next step in smaller transistors. Like NXE systems, it uses EUV light to print tiny features on silicon wafers. And by turning the NA knob, we deliver even better resolution: The new platform, known as EXE, offers chipmakers a CD (critical dimension) of 8 nm. That means they can print …

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Breakthrough Toward Below 1 Nanometer Chips

TSMC (Taiwan Semiconductor), Massachusetts Institute of Technology (MIT) and National Taiwan University (NTU) have shown a process that uses the semi-metal bismuth to enable the manufacture of semiconductors below 1-nanometer (nm). It will take about ten years to actually make below 1 nanometer chips. Historically, the feature size of a chips was the length of …

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TSMC Arizona Fab Plans Increasing by 3 to 6 Times

Taiwan Semiconductor Manufacturing Co Ltd (TSMC) is planning to build several more chipmaking factories in the U.S. state of Arizona beyond the one currently planned. In May 2020, TSMC announced they would build a $12 billion factory in Arizona. This was a win for the Trump administration to bring global tech supply chains back from …

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TSMC Roadmap to One Million Times Better Energy Efficient Compute Performance by 2040

Here is a presentation by Taiwan Semiconductor Chairman Liu. TSMC and Samsung are the current masters of EUV lithography. TSMC has the lead. Extreme ultraviolet (EUV) lithography has enabled TSMC to achieve higher patterning fidelity, shorter cycle times and reduced process complexity and defect rates. TSMC uses EUV in ten mask layers for the 5nm …

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ASML 1 to 2 Nanometer Chips Will Power Next Generation Technological Revolution

EUV Lithography is enabling another reduction in chip dimensions by 5 to 10 times in line geometry and this will extend Moore’s law and improve processing speed, component density and reduce energy used. ASML is a world leader in lithography equipment. ASML 2019Q3 net sales came in at EUR3 billion. This will power 5G connectivity, …

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TSMC 7+ Nanometer Chips Are in High Volume Production With 5, 6 nm in 2020

TSMC (Taiwan Semiconductor) announced that its seven-nanometer plus (N7+), the industry’s first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume. The N7+ process with EUV technology is built on TSMC’s successful 7nm node and paves the way for 6nm and more advanced technologies. The leading edge is …

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EUV Lithography Solved So 5 Nanometer in Months and 6 Years to 2 Nanometers

AMD has released the 7 nanometer 3900, 3950 and other Ryzen 3 processors. Samsung could be months from production of its 5-nanometer chips. This is all due to EUV (Extreme Ultraviolet) lithography finally getting solved. EUV lithography technology that we were waiting for 15 years for the semiconductor industry to solve. Extreme ultraviolet lithography is …

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TSMC will starting full EUV lithography of 5 nanometer chips April 2019

TSMC (Taiwan Semiconductor) taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in April on a 5-nm node with full EUV. The foundry’s update showed that area and power gains continue in its leading-edge nodes, but chip speeds are no longer advancing at their …

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Extreme Ultraviolet Lithography is finally happening for 7 nanometer and 5 nanometer chips

Extreme ultraviolet lithography (EUV) is set to enable 10-nm and 7-nm process nodes over the next few years, but significant work is still needed on photoresists to enable 5-nm chips. ASML has plans in place to increase uptime of the systems from about 75% today to 90%, a top concern for lithographers, said Jones. In …

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TSMC 7 nanometer fab ramping in 2018, 5 nm in 2019, 3 nm Fab in 2021-2022

Taiwan Semiconductor Manufacturing Co. (TSMC) will build the world’s first 3-nm fab in the Tainan Science Park in southern Taiwan, where the company does the bulk of its manufacturing. About a year ago, TSMC said it planned to build its next fab at the 5-nm to 3-nm technology node as early as 2022. The more …

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