TSMC (Taiwan Semiconductor), Massachusetts Institute of Technology (MIT) and National Taiwan University (NTU) have shown a process that uses the semi-metal bismuth to enable the manufacture of semiconductors below 1-nanometer (nm). It will take about ten years to actually make below 1 nanometer chips. Historically, the feature size of a chips was the length of …
Taiwan Semiconductor Manufacturing Co Ltd (TSMC) is planning to build several more chipmaking factories in the U.S. state of Arizona beyond the one currently planned. In May 2020, TSMC announced they would build a $12 billion factory in Arizona. This was a win for the Trump administration to bring global tech supply chains back from …
Here is a presentation by Taiwan Semiconductor Chairman Liu. TSMC and Samsung are the current masters of EUV lithography. TSMC has the lead. Extreme ultraviolet (EUV) lithography has enabled TSMC to achieve higher patterning fidelity, shorter cycle times and reduced process complexity and defect rates. TSMC uses EUV in ten mask layers for the 5nm …
EUV Lithography is enabling another reduction in chip dimensions by 5 to 10 times in line geometry and this will extend Moore’s law and improve processing speed, component density and reduce energy used. ASML is a world leader in lithography equipment. ASML 2019Q3 net sales came in at EUR3 billion. This will power 5G connectivity, …
TSMC (Taiwan Semiconductor) announced that its seven-nanometer plus (N7+), the industry’s first commercially available Extreme Ultraviolet (EUV) lithography technology, is delivering customer products to market in high volume. The N7+ process with EUV technology is built on TSMC’s successful 7nm node and paves the way for 6nm and more advanced technologies. The leading edge is …
AMD has released the 7 nanometer 3900, 3950 and other Ryzen 3 processors. Samsung could be months from production of its 5-nanometer chips. This is all due to EUV (Extreme Ultraviolet) lithography finally getting solved. EUV lithography technology that we were waiting for 15 years for the semiconductor industry to solve. Extreme ultraviolet lithography is …
TSMC (Taiwan Semiconductor) taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in April on a 5-nm node with full EUV. The foundry’s update showed that area and power gains continue in its leading-edge nodes, but chip speeds are no longer advancing at their …
Extreme ultraviolet lithography (EUV) is set to enable 10-nm and 7-nm process nodes over the next few years, but significant work is still needed on photoresists to enable 5-nm chips. ASML has plans in place to increase uptime of the systems from about 75% today to 90%, a top concern for lithographers, said Jones. In …
Taiwan Semiconductor Manufacturing Co. (TSMC) will build the world’s first 3-nm fab in the Tainan Science Park in southern Taiwan, where the company does the bulk of its manufacturing. About a year ago, TSMC said it planned to build its next fab at the 5-nm to 3-nm technology node as early as 2022. The more …
Today ASML is selling billions in Extreme Ultraviolet lithography machines. These machines will help deliver chips at the 5 nanometer to 2 nanometer nodes. ASML (Veldhoven, the Netherlands) sold eight more EUV (next-generation extreme ultraviolet lithography) systems in the second quarter. This brings its EUV backlog to 27 tools valued at about 2.8 billion euro …
By the 2030s — Russia may become less dangerous than Iran, which military strategist Andrew Krepinevich forthcoming study from the Center for Strategic and Budgetary Assessments ranks currently at No. 3. Krepinevich’s analysis of Russia is similar to Nextbigfuture. Nextbigfuture had noted that long term low oil and gas prices and shrinking population are trends …
