Improved Cooling for 3D Microchips With Signicant 3D Chip Deployment Expected 2015-2020
CMOSAIC (European Project) could boost the computing performance of central processors by a factor 10 while consuming less energy. 3D microprocessors cooled from the inside through channels as thin as a human hair filled with a liquid coolant. Such is the solution currently being developed by researchers from the EPFL (Ecole polytechnique fédérale de Lausanne, …