NEO Semiconductor 3D X-DRAM With 8x the Density Of DDR5 Computer Memory
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 layers. This is 8 times greater compared to today’s best solutions with DDR5 technology. Neo Semiconductor is located in San Jose, California. 3D stacking of silicon …
