TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI chips. The production capacity of CoWoS packaging technology is a major bottleneck in AI chip output and will stay as a problem for AI chip supply in 2024. Nvidia H100 (AI chips) …
SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial intelligence (AI) craze. TSMC is the world’s largest semiconductor foundry (consignment production) company. The strategy is to consolidate the victory of the two companies in …
Samsung has a new roadmap that targets mass production of 2nm process technology by 2025 and 1.4nm by 2027. TSMC is planning to start production of 2-nm chips in 2025. Intel Foundry Services (IFS) plans to offer its own GAA-based process at its 18-A node that’s equivalent to 2 nm by 2024. Samsung plans to …
There are claims that Intel’s full 10-nanometer process chip is equal to the TSMC 7N chip. TSMC seems to be 40% better in transistor density with its 5N plus chip and will make more improvements with a 4N chip. Even if TSMC process descriptions are just marketing, TSMC has superior transistor density, lower costs and …