StumbleUpon<\/a><\/b>. Thanks<\/i><\/p>\n","protected":false},"excerpt":{"rendered":"3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon \u201ctowers.\u201d The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers … <\/p>\n
Read more<\/a><\/p>\n","protected":false},"author":2,"featured_media":57641,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[33,235,14,155,43,11],"_links":{"self":[{"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/posts\/13325"}],"collection":[{"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/comments?post=13325"}],"version-history":[{"count":0,"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/posts\/13325\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/media\/57641"}],"wp:attachment":[{"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/media?parent=13325"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/categories?post=13325"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.nextbigfuture.com\/wp-json\/wp\/v2\/tags?post=13325"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}