{"id":13325,"date":"2011-09-08T19:28:00","date_gmt":"2011-09-08T19:28:00","guid":{"rendered":"http:\/\/198.74.50.173\/2011\/09\/3m-and-ibm-to-develop-new-types-of.html"},"modified":"2017-04-07T04:53:40","modified_gmt":"2017-04-07T04:53:40","slug":"3m-and-ibm-to-develop-new-types-of","status":"publish","type":"post","link":"https:\/\/www.nextbigfuture.com\/2011\/09\/3m-and-ibm-to-develop-new-types-of.html","title":{"rendered":"3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors"},"content":{"rendered":"

3M and IBM today announced that the two companies plan to jointly develop the first adhesives<\/a> that can be used to package semiconductors into densely stacked silicon \u201ctowers.\u201d The companies are aiming to create a new class of materials, which will make it possible to build, for the first time, commercial microprocessors composed of layers of up to 100 separate chips. <\/p>\n

Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a \u201cbrick\u201d of silicon that would create a computer chip 1,000 times faster than today\u2019s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices. <\/p>\n

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The companies\u2019 work can potentially leapfrog today\u2019s current attempts at stacking chips vertically \u2013 known as 3D packaging. The joint research tackles some of the thorniest technical issues underlying the industry\u2019s move to true 3D chip forms. For example, new types of adhesives are needed that can efficiently conduct heat through a densely packed stack of chips and away from heat-sensitive components such as logic circuits.<\/p><\/blockquote>\n

IBM and 3M Corp. are developing a new type of electronic \u201cglue\u201d that can be used to build stacks of semiconductors \u2013 3D chips. The glue, shown in blue above, connects up to 100 separate chips as it conducts heat away from the silicon package. The innovation will create microprocessors 1,000 times more powerful than today\u2019s PC chips.  <\/em><\/p>

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\u201cToday’s chips, including those containing \u20183D\u2019 transistors, are in fact 2D chips that are still very flat structures,\u201d said Bernard Meyerson, VP of Research, IBM. \u201cOur scientists are aiming to develop materials that will allow us to package tremendous amounts of computing power into a new form factor \u2013 a silicon \u2018skyscraper.\u2019 We believe we can advance the state-of-art in packaging, and create a new class of semiconductors that offer more speed and capabilities while they keep power usage low — key requirements for many manufacturers, especially for makers of tablets and smartphones.\u201d <\/p><\/blockquote>\n

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