In Dec, 2005, Fujitsu announced that they were able to connect carbon nanotube bumps to the miniature electrode of a high power transistor. Carbon nanotubes have thermal conductivity of 1400W/(m-K) – a level much higher than that of metal(4), and because it is possible to connect carbon nanotube-based bumps very near to the heat-generating miniature electrodes, Fujitsu successfully achieved the high amplification of flip-chips with heat dissipation levels equivalent to face-up structures.
Reversible computing paper talking about limiting heat generation This can be done as well as spacing out the system to be less dense.
Typical passive emission 3.5 * 10 ** 22 flux bits/s cm**2 (about 100W per square centimeter)
Drexler’s fractal plumbing 3.8 * 10 ** 24 flux bits/s cm**2 (about 10-100KW of heat removed per square centimeter)
Slow atomic ballistic (theoretical 1 m/s coolant) flux 10 ** 26 bits/s cm**2
Fast atomic ballistic (theoretical relativistic speed coolant) flux 3 * 10 ** 33 bits/s cm**2
Quantum maximum 5 * 10 ** 40 flux bits/s cm**2
Existing cooling is at about 1KW per square centimeter using microchannels with force d liquid convection (David Tuckerman)