DARPA Developing Next-Generation Microelectronics

DARPA has selected 11 organizations to begin work on the Next-Generation Microelectronics Manufacturing (NGMM) program.

Selected teams are Applied Materials, Inc., Arizona State University, BRIDG, HRL Laboratories, Intel Federal, North Carolina State University, Northrop Grumman Space Systems, Northrop Grumman Mission Systems, PseudolithIC, Raytheon Technologies, and Teledyne Scientific & Imaging.

Development of 3DHI technologies creates the ability to stack separately manufactured components – chips or wafers originating in different facilities, containing different semiconductors and materials – within a single package. In realizing 3DHI microelectronics that incorporate diverse materials beyond silicon, NGMM focuses on revolutionary improvements in functionality and performance. Moreover, these advances provide an opportunity for U.S. leadership in cutting-edge microelectronics of the future.

NGMM is a cornerstone of ERI 2.0, a DARPA initiative to ensure domestic leadership in cross-functional, future-focused microelectronics research, development, and manufacturing.

The Electronics Resurgence Initiative (ERI), DARPA’s response to national-level microelectronics concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development, and manufacturing. The initiative, aimed at both national security capabilities and commercial economic competitiveness and sustainability, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry, the defense industrial base, and university researchers.

ERI is focusing research in:

* Manufacturing complex 3D systems
* Developing electronics for extreme environments
…while maintaining the following thrust areas:

* Optimizing design and test for complex circuits and prototypes
* Overcoming security threats across the entire hardware lifecycle
* Increasing information processing density and efficiency
* Accelerating innovation in artificial intelligence hardware to make decisions at the edge faster
* Securing communications

7 thoughts on “DARPA Developing Next-Generation Microelectronics”

  1. DARPA has not seen the ball since the kickoff. DARPA is so far behind leading edge technology that not one leading edge player participates in this farce. Technology leaders do not share their future technology plans. Technology leaders do not contract with government because specifications and paperwork are tedious, awkward, expensive, and orders are small. Government can take leading edge off the shelf or use their twenty year old home grown technologies.

    • Fabless, durr. Still, looking forward to AMD Side rejoinder to TSMC Americas’ “not enough cannily trained workers here” neé “It’s a Grand Old Party Disutopia, noone wants to game,” “AI just being used for cruelty, offering options on AVX 777 and other ludic instructions via F1000,” “Hindi are right, improving bioscience and dairy with QOL improvement there (plus props to peaceful Muslim Indians including our participants.)

      nVidia has its own opinions about partnering and gov/mil lead scrimmage. Sort of toes-first USA.

  2. DARPA exemplifies a good workshop effort. However a KEY, fundamental and crucial goal of DARPA’s workshop should be avoiding pursuit of this tech in a way that negates its utility, as happened with the LHC hunt for the Higgs Boson (an inordinately costly blunder).

  3. Well, it took a long while – way too long – for our federal elected leaders and beaurocrats to see the danger of offshoreing advanced manufacturing.

    Let’s all work together to ensure our food, medicines, advanced semiconductors, fundamental electronics, and bleeding-edge vehicles (including airplanes, cars, trucks, and railway locomotives) have a strong manufacturing base in the US. Nonpartisan/bipartisan agreement on this issue is massive.

    Thank God for disruptors like Elon Musk. He’s restored my faith that America can still lead the world in technology and innovation in regards to manufacturing.

  4. Well, it took a long while – way too long – for our federal elected leaders and beaurocrats to see the danger of offshoreing advanced manufacturing.

    Let’s ensure our food, medicines, advanced semiconductors, fundamental electronics, and bleeding-edge vehicles (including airplanes, cars, trucks, and railway locomotives) have a strong manufacturing base in the US. Nonpartisan/bipartisan agreement on this issue is massive.

    Thank God for disruptors like Elon Musk. He’s restored my faith that America can still lead the world in technology and innovation regarding manufacturing.

  5. At last, a use for tax-payer dollars I can really approve of.

    Only problem is DARPA is a bit of an embarrassment for the US gov’t. It keeps making money and that’s inconvenient for their bookkeeping.

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