50 nm metallic stamping process
Creating high-resolution metallic interconnects is an essential part of the fabrication of microchips and other nanoscale devices. Researchers at the University of Illinois at Urbana-Champaign have developed a simple and robust electrochemical process for the direct patterning of metallic interconnects and other nanostructures. Fang said the newly created “S4 process” uses a patterned superionic material …