Floppy thin silicon wafer of power semiconductor chips that can reduce global power consumption by 25%
Infineon Technologies AG has produced the first chips (“first silicon”) on a 300-millimeter diameter thin wafer for power semiconductors at the Villach site in Austria. This makes Infineon the first company in the world to succeed in taking this step forward. The chips now produced on a 300-millimeter thin wafer exhibit the same behavior as …