The 2015 IEEE international Solid-State Circuits Conference (ISSCC) is on this week
The first chips based on Intel’s new 10nm process are expected in late 2016 to early 2017.
The 7 nanometer chips will use III-V semiconductors.
Extreme UV (EUV) lithography will not be used by Intel for the 10 nanometer chips and will not be used for the 7 nanometer chips.
Intel indicates that 10 nm chips will come with innovation, and getting down to 7 nm will require new materials and processes which Intel wants to promote as a progressive integration between process development and the product design teams. New materials and device structures are key elements on that list, and while III-V materials were discussed in the ISSCC preview, no exact details were given.
SOURCES – ISSCC, Anandtech, Intel
Brian Wang is a Futurist Thought Leader and a popular Science blogger with 1 million readers per month. His blog Nextbigfuture.com is ranked #1 Science News Blog. It covers many disruptive technology and trends including Space, Robotics, Artificial Intelligence, Medicine, Anti-aging Biotechnology, and Nanotechnology.
Known for identifying cutting edge technologies, he is currently a Co-Founder of a startup and fundraiser for high potential early-stage companies. He is the Head of Research for Allocations for deep technology investments and an Angel Investor at Space Angels.
A frequent speaker at corporations, he has been a TEDx speaker, a Singularity University speaker and guest at numerous interviews for radio and podcasts. He is open to public speaking and advising engagements.