Intel describing 10 nanometer chips and 7 nanometer will need new materials

The 2015 IEEE international Solid-State Circuits Conference (ISSCC) is on this week

The first chips based on Intel’s new 10nm process are expected in late 2016 to early 2017.

The 7 nanometer chips will use III-V semiconductors.

Extreme UV (EUV) lithography will not be used by Intel for the 10 nanometer chips and will not be used for the 7 nanometer chips.

Intel indicates that 10 nm chips will come with innovation, and getting down to 7 nm will require new materials and processes which Intel wants to promote as a progressive integration between process development and the product design teams. New materials and device structures are key elements on that list, and while III-V materials were discussed in the ISSCC preview, no exact details were given.

SOURCES – ISSCC, Anandtech, Intel

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