IBM Work on 3D chip stacking will take Moore’s Law to 2025
Ads : Nano Technology Netbook Technology News Computer Software Last week, IBM, École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) signed a four-year collaborative project called CMOSAIC to understand how the latest chip cooling techniques can support a 3D chip architecture. Unlike current processors, the CMOSAIC project considers a …