Taiwan Semiconductor will be mass-producing Apple’s new M2 chip in July for use in MacBooks for the second half of 2021. The M2 will eventually be used in other Mac and Apple devices beyond the MacBook. The new chipset is produced by key Apple supplier Taiwan Semiconductor Manufacturing Co., the world’s largest contract chipmaker, using …
TSMC’s 5nm is in mass production. The 3nm will also be put into production in 2022. The more advanced 2nm process is also reported to have made significant progress. The 2nm process will start mass production around 2023 to 2024. TSMC thinks risk trial production yield in the second half of 2023 can reach 90%. …
The Cerebras Wafer Scale Engine (WSE) was presented at Hot Chips. Sanders Olson provided Nextbigfuture with the presentation deck. The Cerebras in the most powerful processor for AI with 1.2 trillion transistors. It has * 400,000 AI-optimized cores * the wafer has 46,225 square millimeters of area * it is silicon * 1.2 trillion transistors …
The IEEE International Roadmap for Devices and Systems (IRDS) has a roadmap to one-nanometer semiconductor devices in 2033. The updated IRDS includes new information on cryogenic electronics and quantum information processing, added benchmarks for applications, and supplemental information and metrics from the More Moore team. There is an update to Beyond CMOS and updates for …
The best commercial computer chips have seven-nanometre transistors and a team in China led Professor Yin Huaxiang has developed 3nm transistors in the lab. Samsung, Intel, Samsung and Taiwan Semiconductor will all be commercially producing 3-nanometer chips in 2020 or 2021. High-performance negative capacitance p-type FinFETs (p-FinFETs) with a 3-nm-thick ferroelectric (FE) hafnium zirconium oxides …
Samsung plans to bring to mass production in 2021 the architectural successor to FinFETS, gate-all-around (GAA) transistors, at the 3nm (nanometer) node. They will begin 7nm (nanometer) production using extreme ultraviolet (EUV) lithography in the second half of this year at its annual foundry technology forum. Process Technology Roadmap Updates * 7LPP (7nm Low Power …
IBM and its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips. The details of the process will be presented at the 2017 Symposia on VLSI Technology and Circuits conference in Kyoto, Japan. In less than two years …
ASML expects to ship 20 to 24 extreme ultraviolet (EUV) lithography tools next year as the industry continues edging closer to production deployment of the oft-delayed next-generation lithography technology. Peter Wennink, ASML’s president and CEO, told analysts following the company’s first quarter financial report Wednesday that the company continues to make progress toward its goals …
By the 2030s — Russia may become less dangerous than Iran, which military strategist Andrew Krepinevich forthcoming study from the Center for Strategic and Budgetary Assessments ranks currently at No. 3. Krepinevich’s analysis of Russia is similar to Nextbigfuture. Nextbigfuture had noted that long term low oil and gas prices and shrinking population are trends …
Intel’s latest desktop processor (Kaby Lake) offers no performance improvement over its predecessor. In a few years, Intel’s Optane, a superfast SSD (solid state drive) and DRAM replacement that could ultimately unify memory and storage, could cause a radical change in PC architecture. The first Optane SSDs will be in enthusiast PCs, and could cost …
The Project 955A nuclear submarine Prince Vladimir and the Project 885M Yasen-M nuclear-powered underwater cruiser Kazan will be floated out in 2017, Russian Navy Deputy Commander-in-Chief Vice-Admiral Viktor Bursuk The Prince Vladimir was laid down in 2012 and will become the fourth submarine in the series of eight Borei-class underwater cruisers and the first submarine …