Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO Semiconductor’s CEO, Andy Hsu, gave keynote presentation at FMS: the Future of Memory and Storage 2025. I, Brian Wang, attended. Neo Semiconductor is a private, …
TSMC 3nm process node is the best FinFET technology and TSMC dominates semiconductor chip fabrication with higher transistor density, better yields on a mature technology and broad adoption by clients like Apple and NVIDIA. TSMC’s 2nm Process Scale-Up TSMC’s 2nm (N2) process will introduce nanosheet transistors (a form of Gate-All-Around or GAA architecture). It is …
Imec is a world-leading research and innovation center in nanoelectronics and digital technologies. Imec has more than 6.000 employees and top researchers, for R&D in advanced semiconductor and system scaling, silicon photonics, artificial intelligence and more. They have been publishing semiconductor roadmaps. They are working with Tokyo Electron. IMEC Releases Semiconductor Process Roadmap to 2039 …
TSMC introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters. At the TSMC 2024 North America Technology Symposium, they debuted the TSMC A16™ technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing …
Huawei’s Kirin 9000S system-on-chip powers Huawei’s new Mate 60 Pro smartphone reportedly is using 2nd generation 7nm-class fabrication process and stacking made by China-based SMIC. Huawei was known to have been stockpiling chips from its HiSilicon unit before TSMC cut ties to comply with US sanctions. TSMC started making 7 nanometer chips back in 2017. …
Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 layers. This is 8 times greater compared to today’s best solutions with DDR5 technology. Neo Semiconductor is located in San Jose, California. 3D stacking of silicon …
New materials may also enable entirely new paradigms for individual chip components and their overall design. One long-promised advance is the ferroelectric field-effect transistor, or FE-FET. Such devices could switch states rapidly enough to perform computation, but also be able to hold those states without being powered, enabling them to function as long-term memory storage. …
AI chip Startup Graphcore IPU systems are designed to lower the cost of accelerating AI applicationsA in cloud and enterprise datacenters to increase the performance of both training and inference by up to 100x compared to the fastest systems today. Graphcore systems excel at both training and inference. The highly parallel computational resources together with …
Cells in the amniotic fluid that surrounds a developing baby can revive ageing and weak bones, say UK scientists. The discovery could help babies with genetic diseases, elderly people and even astronauts, they say. The findings in mice, published in Scientific Reports, showed cells in the fluid strengthened bone and cut fractures by 80%. Human …
The IMF predictions for nominal GDP and PPP were inaccurate in the early 2000s, because of adjustments that shifted purchasing power parity and currency fluctuations. Currency is still fluctuating as the Chinese yuan has weakened enough to eliminate projected nominal GDP gains in 2016. IMF nominal GDP projections Purchasing power parity had a large adjustment …
An Earth-like planet that orbits Proxima Centauri in its habital zone has been found. The discovery was made by the European Southern Observatory (ESO) using the La Silla Observatory‘s reflecting telescope. The European Southern Observatory (ESO) will be announcing the finding at the end of August. Universe Today reported the discovery from a der Spiegel …